The WP1000 workstation is designed for the bulk removal of protective
cover films from semiconductor wafers. The beam from a TEA-CO2 laser (e.g. GSI Lumonics Impact™ series) is converted through the optical beam
delivery system to the desired size, shape and energy density for the
process requirements. Controlling the rate of movement of the wafer under
the beam, and the pulse repetition rate of the laser, defines the total
dose of light seen by any particular portion of the wafer. In addition to
bulk processing with the whole beam, aperture masks can be used, allowing
precision processing of select areas of the wafer.
The team at Process Photonics has a wealth of process and applications
knowledge, as well as years of experience in building standard and custom
systems. Let them build you a robust, production-ready workstation that is
easy to operate and maintain.
| System Hardware |
|
System Control |
| · Accepts GSI Lumonics Impact™ 2000
and 3000 series TEA-CO2 lasers, or lasers with similar beam
characteristics |
|
· Windows XP® based user interface
· User friendly
operator screens |
| · CDRH Class 1 enclosure |
|
· Full system diagnostics |
| ·
Compatible with class 10,000 clean room environments |
|
· Saving of multiple
job parameter files |
| · Vacuum chuck accepts 6"(150mm), 8"
(200mm) or 12" (300mm) wafers |
|
· Password protection for access to
configuration, set-up, and operating screens |
| · Manual wafer loading |
|
·
Emergency stop and safety interlock circuits |
| · Precision ball screw XY
stages with high resolution encoder feedback |
|
· Optional SECS II/GEM
communications interface |
| · High performance motion and laser controller |
|
|
|
· XY stage travel: up to 12"x12" (300 mm x 300 mm) |
|
Utilities
(workstation only) |
| · Optical beam delivery configurable for focused spot,
line, or mask imaged machining at 9.3 or 10.6µm |
|
· Electrical: 120 VAC,
single phase, 60Hz, 15 Amps; or220-240 VAC, single phase, 50Hz, 10 Amps |
| ·
Large process viewing window |
|
· Exhaust: ablation debris removal through
1.5" diameter duct, 100 SCFM typical |
| · Optional automatic wafer
loading/unloading |
|
· Vacuum: 25-30" Hg @ 2 SCFM |
| · Optional integrated power meter for process control |
|
· Dimensions (HxWxD): 72"x40"x34" 1817mm x
1010mm x 864mm (excluding laser) |
| · Optional vision system for precision
alignment |
|
· Weight: 1050 lbs (475 Kg) (excluding
laser) |
| Process Parameters |
|
|
| · Continuous line and area scanning, or point
to point processing |
|
|
| · Programmable laser pulse rate, pulse overlap, and
scanning area |
|
CE compliant |
| · Adjustable laser beam shape and energy
density |
|
* specifications are subject to revision and change |
| |
|
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download WP1000 data
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