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FP Series Flex and Rigid-Flex Circuit Processing Systems |
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Process Photonics has developed the rugged FP platform, a unique workstation design that has been configured for use with industry-proven CO2 and UV laser sources. Three basic configurations are available:
The FP1000, with an RF-excited CO2 laser for optimized machining in all common polymer materials, as well as green ceramic tape.
The FP2000, with a UV laser for optimized process quality in all common polymer materials, plus the ability to machine copper
The FP3000, with an RF-excited CO2 laser for optimized machining in all common polymer materials, plus a UV laser for copper machining
Lasers have been used to process flex circuits for over 15 years. The current requirements for precision processing of parts for the hard disk drive industry (suspension flex) and the electronics packaging industry (chip on flex, multi-chip modules, PCMCIA cards) are typical of the applications where lasers provide manufacturers with significant advantages. The FP Series form the ultimate processing workstations for flex, with high performance galvos for rapid point-to-point drilling and routing complex features. The CO2 laser is appropriate for high speed machining (drilling, cutting and skiving) of polyimide, while the UV laser is able to machine copper and provide higher cut quality in polyimide. In addition, the system can process glass- and aramid-reinforced epoxies and resin-coated foil for rigid and rigid-flex applications. Consult the flex
processing applications note for more information. |
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Copyright © 2004 PPI Systems Inc. All rights reserved. |
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