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Based on the rugged FP
platform, the FP2000 workstation utilizes a production-proven diode-pumped
solid state UV laser for optimized machining in all common polymer
materials - polyimide
- copper - cover films
(polyimide, acrylic, epoxies) -
rigid-flex (FR4, aramid reinforcement)
- solder resist
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FP2000 |
| Integrated laser machining
tool for high volume production |
| Configured for a variety of
applications: |
| ·circuit
excising, cutting and routing |
| ·skiving
and reverse baring |
| ·blind via
and through-hole
drilling |
| ·cutting
flying leads |
| ·defect
repair |
| High performance motion
stages for rapid, accurate panel processing |
| UV laser source for
optimum process quality |
| Fully programmable job setup |
| Windows® operator interface |
| Fast job changeover for
prototype work |
 download FP2000 data
sheet
Lasers
have been used to process flex circuits for over 15 years.
The current requirements for precision processing of parts for the
hard disk drive industry (suspension flex) and the electronics packaging
industry (chip on flex, multi-chip modules, PCMCIA cards) are typical of
the applications where lasers provide manufacturers with significant
advantages.
The FP2000 is the
ultimate processing workstation for flex, with high performance galvos for
rapid point-to-point drilling and routing complex features.
The UV laser is appropriate for high speed machining (drilling, cutting
and skiving) of polyimide with excellent edge quality, as well as cutting
copper traces for suspended leads.
In addition, the
system can process glass- and aramid-reinforced epoxies and resin-coated
foil for rigid and rigid-flex applications.
Consult the flex
processing applications note for more information.
Specifications*
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System Hardware |
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· High power UV laser
(several models available, starting at 2W) |
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· Configured with high
performance galvanometer scanners for high speed feature skiving,
cutting and via drilling |
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· Small UV spot for
highest precision |
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· Galvanometer scanning field: 50x50 mm |
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· Maximum panel size
533mm x 635mm
(21" x 25") |
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· Vacuum platen for panel hold-down |
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· Integrated power meter for process control |
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· Precision linear motor XY
stages with high resolution encoder feedback |
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· High performance motion and laser controller |
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· CDRH Class 1 enclosure |
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Large process viewing window |
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· Automated vision system for precision
alignment, and scaling, offset, trapezoidal and rotation compensation |
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· Beam placement accuracy: 15µm (3
sigma) over panel process area |
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· Ultrastable steel weldment frame with resonance dampening |
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· Compliant with CE and North American regulations |
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· Optional automatic panel loader/unloader |
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· Easy integration with customer-supplied roll-to-roll equipment |
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Utilities
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· Electrical: 208 VAC,
single phase, 25A, 60Hz; or 400 VAC, single phase, 15A, 50Hz. |
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· Exhaust: ablation debris removal through
3" (76mm) diameter duct, 100 SCFM typical |
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· Dimensions (HxWxD):
93"x64"x86"
2356mm x 1626mm x
2192mm |
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· Weight: 2773 kg (6100 lbs) |
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System Control |
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· Windows XP® based user interface
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· User friendly
operator screens |
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· Compatible with all industry standard file formats |
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· Rapid drill file
conversion and path optimization utility. |
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· System monitoring for
process integrity |
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· Full system diagnostics |
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· Saving of multiple
job parameter files |
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· Password protection for access to
configuration, set-up, and operating screens |
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Emergency stop and safety interlock circuits |
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· Optional network interface |
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Process Parameters |
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· UV laser source minimizes heat affected zone and produces clean
edges with minimum process residue |
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· Continuous line and area scanning, circuit
excising or point
to point processing |
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· Programmable laser pulse rate, pulse overlap, and
scanning area |
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· Adjustable laser beam shape and energy
density |
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· Automatically process stepped vias |
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· Via sizes from 40µm to 250µm |
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· Via roundness error: 10% maximum |
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· Drilling rates up to 500 blind vias/sec within galvo field |
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· Cutting rates up to 100 mm/sec |
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· Consult PPI for cutting rates in your material. |
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| * specifications are subject to
revision and change |
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