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ProVia™ Series Laser-Based Drilling Systems |
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Process Photonics has developed the rugged ProVia platform, a unique workstation design that has been configured for use with industry-proven CO2 and UV laser sources. Three basic configurations are available:
The ProVia-C with an RF-excited CO2laser for optimized machining in all common polymer materials, as well as green ceramic tape. Via sizes down to 80µm diameter.
The ProVia-UV with a UV laser for optimized process quality in all common polymer materials, plus the ability to machine copper. Via sizes down to 40µm diameter.
The ProVia-H, with an RF-excited CO2 laser for optimized machining in all common dielectric materials, plus a UV laser for copper machining.
Laser drilling of microvias is now commonplace in the electronics packaging industry, allowing high density circuits to be made for a range of products from cellular phones and other hand-held devices to chip on flex, multi-chip modules, and PCMCIA cards. The ProVia drillers provide the ultimate processing workstations for rigid boards, with high performance galvos for rapid point-to-point drilling and precise control for fine features. The CO2 laser is appropriate for high speed machining (drilling, cutting and skiving) of dielectrics, while the UV laser is able to machine copper and provide higher cut quality in many dielectrics. An optional second galvo head for CO2 -only or UV-only systems can increase drilling speeds up to 2X over the standard single-head configuration. Whether your application is with glass- and aramid-reinforced epoxies or non-reinforced materials (e.g. resin-coated foil), there is a ProVia model to meet your requirements. |
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Advanced ProSys™ Control Software Perform drill file conversion and job generation Provides a map of the job features and status on the progress of the job Custom tool creation and assignment
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Copyright © 2004 Process Photonics Inc. All rights reserved. |
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