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The ProVia-UV workstation models utilize the production-proven
diode-pumped solid state lasers for high quality, precision processing of
a variety of materials. Some customers prefer segregation of the
processes employed in the hybrid drilling machines, i.e. separate UV
drillers and CO2
drillers. The UV laser can be used to drill openings of
the required size in the top copper foil, allowing access for dielectric
drilling with the CO2
laser on a subsequent machine (e.g. the ProVia-C). In addition, the
UV can be used to drill dielectrics, especially producing excellent
quality in non-reinforced materials.
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ProVia-UV |
| UV laser for
precision machining of Cu and most dielectrics |
| Integrated laser
machining tool for high volume production |
| Configured for a variety of
applications: |
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·blind via and through-hole drilling |
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·circuit excising, cutting and routing |
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·defect repair |
| Dual-head model available |
| Horizontal or
semi-vertical load/unload |
| Slip sheet and panel
flipper options |
| Windows® operator
interface |
| |
 ProVia data
sheet
Laser drilling of microvias is now commonplace in the electronics packaging
industry, allowing high density circuits to be made for a range of
products from cellular phones and other hand-held devices to chip on flex, multi-chip modules,
and PCMCIA cards.
The ProVia drillers
provide the
ultimate processing workstations for rigid boards, with high performance galvos
for rapid point-to-point drilling and precise control for fine features.
The CO2
laser is appropriate for high speed machining (drilling, cutting and
skiving) of dielectrics, while the UV laser is able to machine copper and
provide higher cut quality in many dielectrics. An optional second
galvo head for CO2 -only or UV-only systems can increase
drilling speeds up to 2X over the standard single-head configuration.
Whether your application is with glass- and aramid-reinforced epoxies or
non-reinforced materials (e.g. resin-coated foil), there is a ProVia model
to meet your requirements.
Specifications*
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System Hardware |
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· Diode-pumped solid
state UV laser (3W to 20W models available) |
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· Configured with high
performance galvanometer scanners for high speed via drilling,
skiving, and cutting |
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· Galvanometer scanning field: 50x50 mm |
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· Maximum panel size
533mm x 635mm
(21" x 25") |
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· Vacuum platen for panel hold-down |
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· Integrated power meter for process control |
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· Precision linear motor XY
stages with high resolution encoder feedback |
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· High performance motion and laser controller |
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· CDRH Class 1 enclosure |
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·
Large process viewing window |
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· Automated vision system for precision
alignment, and scaling, offset, trapezoidal and rotation compensation |
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· Beam placement accuracy: 15µm (3
sigma) over panel process area |
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· Ultrastable steel weldment frame with resonance dampening |
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· Compliant with CE and North American regulations |
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· Optional automatic panel loader/unloader |
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· Optional dual-head
operation for optimum throughput and value |
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Utilities
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· Electrical: 208 VAC, three phase, 5-wire "WYE",
35A, 60Hz; or 400 VAC, three phase, 5-wire "WYE", 20A,
50Hz. |
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· Exhaust: ablation debris removal through
3" (76mm) diameter duct, 100 SCFM typical |
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· Dimensions (HxWxD):
93"x64"x86"
2356mm x 1626mm x
2192mm |
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· Weight: 2813 kg (6233
lbs) net |
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· Water: 8 l/min,
or optional closed cycle chiller |
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System Control |
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· Windows XP® based user interface
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· User friendly
operator screens |
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· Compatible with all industry standard file formats |
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· Rapid drill file
conversion and path optimization utility. |
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· System monitoring for
process integrity |
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· Full system diagnostics |
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· Saving of multiple
job parameter files |
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· Password protection for access to
configuration, set-up, and operating screens |
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·
Emergency stop and safety interlock circuits |
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· Optional network interface |
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Process Parameters |
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· Point-to-point moves,
continuous line and area scanning, and circuit excising |
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· Programmable laser pulse rate, pulse overlap, and
scanning area |
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· Tool creation
function |
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· Automatically process stepped vias |
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· Via sizes down to 40µm |
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· Via roundness error: 10% maximum |
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· Drilling rates up to 500 blind vias/sec within galvo field |
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· Cutting rates up to
100mm/sec (UV) |
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· Consult PPI for processing rates in your material. |
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| * specifications are subject to
revision and change |
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