PPI Home > Applications

Applications Overview

Since their invention, lasers have been employed for a wide range of materials processing applications.  Many of these applications have proven to be enabling processes, allowing significant increases in capability and performance to the industry affected.

The PPI team has extensive expertise in precision laser machining, typically involving the removal of a small amount of material at specific locations. The choice of a laser and beam delivery system for any of these processes is strongly linked to the type of features, size of features, the quality of the process (e.g. lack of process debris, edge quality), the patterns that are required on the part, and the number of parts that will be required, among many other factors.  Some of the processes are thermally-driven (e.g. drilling Cu foil in a PWB with a UV laser source) and others are photochemically-driven (e.g. ablation of polyimide from a flex circuit).  Please visit the Custom Systems page for a list of some of the system configurations that are possible.  Below are just some of the application areas where the PPI team has experience.

• Via drilling in printed wiring boards and ceramic tape

• Machining flexible printed circuits

• Trim and test of printed resistors (e.g. embedded passives)

• Automated Optical Inspection

• Other

  • wirestripping

  • flat panel displays

  • medical device manufacture

The Machine development page describes the many factors that go into the design of a system, starting with the intended application.

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